Five inspection algorithms were developed to determine the quality of Solder-Ball Connect (SBC) joints using scanned-beam X-ray laminography (SBXLAM) to view internal planar structures. The first algorithm measures the critical SBC-joint features, including the ball/pad alignment, the solder thickness, and the average joint-diameter. The other algorithms use these measurements to identify defective SBC joints. During evaluation tests, all algorithms but the open/low-solder algorithm performed exceptionally well in measuring the critical joint-featuresTentifying defective joints. The open/low-solder algorithm could not adequately discern marginal low-solder joints from marginal good joints, primarily due to the generation of imageartifacts by SBXLAM within the focal plane as a result of the dense, out-of-plane solder balls. Several solutions, including a tungsten filter, multiple camera-settings, a normalization scheme, and a revised solder-thickness calibration, improved the performance of the open/low-solder algorithm, but the effect of the out-of-plane solder balls was still significant.