The ability to physically modify prototype Integrated Circuits (ICs) helps in reducing time to market and increases the likelihood of having fully functional board level systems before the IC’s come out in mass production. This can be achieved using a Focused Ion Beam (FIB) system, which can be used to make device/circuit edits on prototype IC’s, in order to correct and subsequently test, design/process flaws, in an iterative manner, before mask changes are made. This includes but is not limited to making metal connections, disconnecting metal lines, make probe pads, speed up/ delay circuits etc.