With the current advances and expertise in biomedical device technologies, transcatheter heart valves (THVs) have been drawing significant attention. Various studies have been carried out on their durability and damage by dynamic loading in operational conditions. However, very few numerical investigations have been conducted to understand the effects of leaflet curvature and thickness on the crimping stresses which arise during the surgical preparation processes. In order to contribute to the current state of the art, a full heart valve model was presented, the leaflet curvature and thickness of which were then parameterized so as to understand the stress generation as a result of the crimping procedure during the surgical preparations. The results show that the existence of stresses is inevitable during the crimping procedure, which is a reduction factor for valve durability. Especially, stresses on the leaflets at the suture sites connected with the skirt were deduced to be critical and may result in leaflet ruptures after THV implantation.